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Standards and conditions

UL, RoHS, REACH, IPCA602/A603 standards

UL

This certifies that all ES-01 and ED-01, single- and double-sided printed circuit boards, as well as multi-layer circuit boards, have been reviewed by Underwriters Laboratories Inc. in accordance with the UL standard.

Safety standard: UL 796 - Printed circuit board - CSA-C22.2 No. 0.17 - evaluation of properties of polymeric materials.

Classification: UL 94V-0 (general classification for printed circuit boards)

RoHS

Restriction of Hazardous Substances

This certifies that all or some of the products we supply comply with the requirements of Directive (EU) 2015/863 on the use of hazardous substances in electrical and electronic equipment. The following list corresponds to the restrictions regarding certain materials and the maximum concentration values tolerated.

Cadmium and its compounds < 100 ppm
Mercury and its compounds < 1000 ppm
Hexavalent chromium and its compounds < 1000 pm
Lead and its compounds < 1000 ppm
Polybrominated biphenyls (PBB) < 1000 ppm
HBCDD < 1000 ppm
DEHP < 1000 ppm
BBP < 1000 ppm
DBP < 1000 ppm

REACH

Formatronic confirms and guarantees that all products supplied comply with the REACH regulation and do not emit any substances.
Formatronic is not subject to registration or compilation of a safety data sheet. In accordance with Article 33 of the REACH code, Formatronic will immediately inform you of any substance considered to be a cause for alarm by the ECHA (European Agency for Chemicals).
We do not currently foresee any such outcome for our products.

Irrespective of this, we are actively seeking compliance with the REACH regulation; we wish to protect this legislation in our own interests and in the interests of our customers. We are working closely with different stakeholders in our production lines’ chemicals departments to rigorously comply with the REACH regulation qualification process.

IPCA602/A603

This certifies that all printed circuit boards are manufactured in accordance with the IPC standard. The IPC standard is the framework for printed circuit board manufacturing. Printed circuit boards are manufactured according to the IPC2 standard unless the specifications specifically require a higher standard such as IPC3. Only the list determined by the IPC standard can be taken into consideration for any defects. Requirements outside that framework will be studied but may not go beyond the scope of that standard under any circumstances.

The list of defects not permissible under IPC2 and IPC3 is the same. The difference is that under IPC2, defects can be repaired whereas this is strictly prohibited under IPC3.

Warranty period of the pcbs

LEAD FREE HAL finishing : 1 year
IMMERSION GOLD finishing : 6 months
OSP finishing : 3 months
IMMERSION SILVER finishing : 6 months
TIN FINISHING : 6 months

The warranty period is effective from the date code mentioned on the printed circuit boards. If the storage exceeds 90 days, we recommend placing them in an oven for a short cycle at 150°c for 2 hours or for a long cycle at 50°c for 8 hours. The ideal storage for the conservation of the pcbs is a dry storage cabinet that provides a dry atmosphere suitable for storing electronic components, equipped and bare printed circuit boards that are sensitive to humidity. Storage temperature : T° = 22°c ± 3°c and Humidity = 50% ± 10 %.

Introduction to IPC standards

The IPC standard seeks to help you develop a rigorous quality approach across your entire production chain, allowing you to present a highly reliable product.
Different standards exist to support you from product research up to delivery. Players in the electronics industry speak the same language, which simplifies the communication and understanding of work requirements.

 


The different types of delivery

Single delivery


Delivery in scoring panel (V-cut)


Delivery in scoring panel including internal rails


Delivery in half scoring / half miling panel


Delivery in miling panel


Delivery in panel including kits: a kit is made of several pcbs, we consider a kit as a single pcb.


Our panels

Our panels include 3 x 1 mm marks and 4 x 3.2 mm non-plated locating holes. It is possible to order panels without X-out (a X-out is a pcb tagged as defect).)
We follow the following rules :
- If the surface is ≤ (less than or equal) 0.49 M² : single and double layers pcb, we can accept up to 100-up without X-out.
- If the surface is ≥ (greater than or equal to) 0.50 M² : we can accept up to 30-up without X-out.
- If the surface is ≥ (greater than or equal to) 0.50 M² : from 4 to 12 layers, we can accept up to 20-up without X-out.


Standard stack-up 2 layers

Type

Type

Thickness (mm)

Rate of Cu

Layers

Silkscreen

White

/

 

 

Soldermask

Green

0,03

 

 

Copper

1oz

0,035

70,00%

Top

Core FR4

1,5

1,43

 

 

Copper

1oz

0,035

70,00%

Bottom

Soldermask

Green

0,03

 

 

Silkscreen

White

/

 

 

Total thickness

 

1,56

 

 


Core  (mm)

FR4

RO4350B

RO4003C

RO3003

0,051

0,101

0,203

0,127

0,076

0,168

0,508

0,254

0,1

0,254

0,813

0,508

0,11

0,508

1,524

0,762

0,13

0,762

 

1,524

0,15

1,524

 

 

 

Standard stack-up 4 layers

Type

Type

Thickness(mm)

Rate of Cu

Layers

Silkscreen

White

/

 

 

Soldermask

Green

0,025

 

 

Copper

1oz

0,035

99,99%

Top

Prepreg

2113

0,0885

 

 

Copper

1oz

0,035

70,00%

L2

Core

1,3

1,23

 

 

Copper

1oz

0,035

70,00%

L3

Prepreg

2113

0,0885

 

 

Copper

1oz

0,035

99,99%

Bottom

Soldermask

Green

0,025

 

 

Silkscreen

White

/

 

 

Total thickness

 

1,597

 

 


Core  (mm)

Prepreg

Prepreg thickness (mm)

FR4

RO4350B

RO4003C

RO3003

0,051

0,101

0,203

0,127

106

0,053

0,076

0,168

0,508

0,254

1080

0,068

0,1

0,254

0,813

0,508

3313

0,097

0,11

0,508

1,524

0,762

2113

0,099

0,13

0,762

 

1,524

2116

0,119

0,15

1,524

 

 

7628

0,197

0,18

 

 

 

106*2

0,106

0,21

 

 

 

106*3

0,159

0,25

 

 

 

106 + 1080

0,121

0,3

 

 

 

106 + 1080*2

0,189

0,36

 

 

 

1080*2

0,136

0,41

 

 

 

1080*3

0,204

0,45

 

 

 

1080 + 3313

0,165

0,51

 

 

 

1080 + 2116

0,187

0,6

 

 

 

1080*2 + 2116

0,255

0,66

 

 

 

2116*2

0,238

0,71

 

 

 

2116*3

0,357

0,8

 

 

 

3313*2

0,194

0,9

 

 

 

1080 + 2116*2

0,306

1

 

 

 

7628*2

0,394

1,1

 

 

 

1080 + 7628

0,265

1,2

 

 

 

1080*2 + 7628

0,333

1,3

 

 

 

2116 + 7628

0,316

1,4

 

 

 

2116*2 + 7628

0,435

1,5

 

 

 

7628*3

0,591

1,6

 

 

 

1080*2 + 2116*3

0,374

1,7

 

 

 

1080*4

0,272

1,8

 

 

 

2116*4

0,476

1,9

 

 

 

106 + 3313

0,15

2

 

 

 

RO4450F

0,102

2,1

 

 

 

RO4450F*2

0,204

2,2

 

 

 

RO4450F*3

0,306

2,5

 

 

 

 

 

3

 

 

 

 

 

3,2

 

 

 

 

 


Standard stack-up 6 layers

Type

Type

Thickness(mm)

Rate of Cu

Layers

Silkscreen

White

/

 

 

Soldermask

Green

0,025

 

 

Copper

1oz

0,035

99,99%

Top

Prepreg

2116

0,1085

 

 

Copper

1oz

0,035

70,00%

L2

Core

0,51

0,51

 

 

Copper

1oz

0,035

70,00%

L3

Prepreg

1080*2

0,115

 

 

Copper

1oz

0,035

70,00%

L4

Core

0,51

0,51

 

 

Copper

1oz

0,035

76,00%

L5

Prepreg

2116

0,1106

 

 

Copper

1oz

0,035

99,99%

Bot

Soldermask

Green

0,025

 

 

Silkscreen

White

/

 

 

Total thickness

 

1,6141

 

 


Core  (mm)

Prepreg

Prepreg thickness (mm)

FR4

RO4350B

RO4003C

RO3003

0,051

0,101

0,203

0,127

106

0,053

0,076

0,168

0,508

0,254

1080

0,068

0,1

0,254

0,813

0,508

3313

0,097

0,11

0,508

1,524

0,762

2113

0,099

0,13

0,762

 

1,524

2116

0,119

0,15

1,524

 

 

7628

0,197

0,18

 

 

 

106*2

0,106

0,21

 

 

 

106*3

0,159

0,25

 

 

 

106 + 1080

0,121

0,3

 

 

 

106 + 1080*2

0,189

0,36

 

 

 

1080*2

0,136

0,41

 

 

 

1080*3

0,204

0,45

 

 

 

1080 + 3313

0,165

0,51

 

 

 

1080 + 2116

0,187

0,6

 

 

 

1080*2 + 2116

0,255

0,66

 

 

 

2116*2

0,238

0,71

 

 

 

2116*3

0,357

0,8

 

 

 

3313*2

0,194

0,9

 

 

 

1080 + 2116*2

0,306

1

 

 

 

7628*2

0,394

1,1

 

 

 

1080 + 7628

0,265

1,2

 

 

 

1080*2 + 7628

0,333

1,3

 

 

 

2116 + 7628

0,316

1,4

 

 

 

2116*2 + 7628

0,435

1,5

 

 

 

7628*3

0,591

1,6

 

 

 

1080*2 + 2116*3

0,374

1,7

 

 

 

1080*4

0,272

1,8

 

 

 

2116*4

0,476

1,9

 

 

 

106 + 3313

0,15

2

 

 

 

RO4450F

0,102

2,1

 

 

 

RO4450F*2

0,204

2,2

 

 

 

RO4450F*3

0,306

2,5

 

 

 

 

 

3

 

 

 

 

 

3,2

 

 

 

 

 


Standard stack-up 8 layers

Type

Type

Thickness(mm)

Rate of Cu

Layers

Silkscreen

White

/

 

 

Soldermask

Green

0,025

 

 

Copper

1oz

0,035

99,99%

Top

Prepreg

3313

0,0865

 

 

Copper

1oz

0,035

70,00%

L2

Core

0,15

0,15

 

 

Copper

1oz

0,035

70,00%

L3

Prepreg

1080+2116*2

0,285

 

 

Copper

1oz

0,035

70,00%

L4

Core

0,25

0,25

 

 

Copper

1oz

0,035

70,00%

L5

Prepreg

1080+2116*2

0,285

 

 

Copper

1oz

0,035

70,00%

L6

Core

0,15

0,15

 

 

Copper

1oz

0,035

70,00%

L7

Prepreg

3313

0,0865

 

 

Copper

1oz

0,035

100,00%

Bot

Soldermask

Green

0,025

 

 

Silkscreen

White

/

 

 

Total thickness

 

1,623

 

 


Core  (mm)

Prepreg

Prepreg thickness (mm)

FR4

RO4350B

RO4003C

RO3003

0,051

0,101

0,203

0,127

106

0,053

0,076

0,168

0,508

0,254

1080

0,068

0,1

0,254

0,813

0,508

3313

0,097

0,11

0,508

1,524

0,762

2113

0,099

0,13

0,762

 

1,524

2116

0,119

0,15

1,524

 

 

7628

0,197

0,18

 

 

 

106*2

0,106

0,21

 

 

 

106*3

0,159

0,25

 

 

 

106 + 1080

0,121

0,3

 

 

 

106 + 1080*2

0,189

0,36

 

 

 

1080*2

0,136

0,41

 

 

 

1080*3

0,204

0,45

 

 

 

1080 + 3313

0,165

0,51

 

 

 

1080 + 2116

0,187

0,6

 

 

 

1080*2 + 2116

0,255

0,66

 

 

 

2116*2

0,238

0,71

 

 

 

2116*3

0,357

0,8

 

 

 

3313*2

0,194

0,9

 

 

 

1080 + 2116*2

0,306

1

 

 

 

7628*2

0,394

1,1

 

 

 

1080 + 7628

0,265

1,2

 

 

 

1080*2 + 7628

0,333

1,3

 

 

 

2116 + 7628

0,316

1,4

 

 

 

2116*2 + 7628

0,435

1,5

 

 

 

7628*3

0,591

1,6

 

 

 

1080*2 + 2116*3

0,374

1,7

 

 

 

1080*4

0,272

1,8

 

 

 

2116*4

0,476

1,9

 

 

 

106 + 3313

0,15

2

 

 

 

RO4450F

0,102

2,1

 

 

 

RO4450F*2

0,204

2,2

 

 

 

RO4450F*3

0,306

2,5

 

 

 

 

 

3

 

 

 

 

 

3,2

 

 

 

 

 


Standard stack-up 10 layers

Type

Type

Thickness(mm)

Rate of Cu

Layers

Silkscreen

White

/

 

 

Soldermask

Green

0,025

 

 

Copper

1oz

0,035

100,00%

Top

Prepreg

1080*2

0,122

 

 

Copper

1oz

0,035

60,00%

L2

Core

0,15

0,15

 

 

Copper

1oz

0,035

60,00%

L3

Prepreg

1080*2

0,108

 

 

Copper

1oz

0,035

60,00%

L4

Core

0,15

0,15

 

 

Copper

1oz

0,035

60,00%

L5

Prepreg

1080+2116

0,159

 

 

Copper

1oz

0,035

60,00%

L6

Core

0,15

0,15

 

 

Copper

1oz

0,035

60,00%

L7

Prepreg

1080*2

0,108

 

 

Copper

1oz

0,035

60,00%

L8

Core

0,15

0,15

 

 

Copper

1oz

0,035

60,00%

L9

Prepreg

1080*2

0,122

 

 

Copper

1oz

0,035

100,00%

Bot

Soldermask

Green

0,025

 

 

Silkscreen

White

/

 

 

Total thickness

 

1,619

 

 


Core  (mm)

Prepreg

Prepreg thickness (mm)

FR4

RO4350B

RO4003C

RO3003

0,051

0,101

0,203

0,127

106

0,053

0,076

0,168

0,508

0,254

1080

0,068

0,1

0,254

0,813

0,508

3313

0,097

0,11

0,508

1,524

0,762

2113

0,099

0,13

0,762

 

1,524

2116

0,119

0,15

1,524

 

 

7628

0,197

0,18

 

 

 

106*2

0,106

0,21

 

 

 

106*3

0,159

0,25

 

 

 

106 + 1080

0,121

0,3

 

 

 

106 + 1080*2

0,189

0,36

 

 

 

1080*2

0,136

0,41

 

 

 

1080*3

0,204

0,45

 

 

 

1080 + 3313

0,165

0,51

 

 

 

1080 + 2116

0,187

0,6

 

 

 

1080*2 + 2116

0,255

0,66

 

 

 

2116*2

0,238

0,71

 

 

 

2116*3

0,357

0,8

 

 

 

3313*2

0,194

0,9

 

 

 

1080 + 2116*2

0,306

1

 

 

 

7628*2

0,394

1,1

 

 

 

1080 + 7628

0,265

1,2

 

 

 

1080*2 + 7628

0,333

1,3

 

 

 

2116 + 7628

0,316

1,4

 

 

 

2116*2 + 7628

0,435

1,5

 

 

 

7628*3

0,591

1,6

 

 

 

1080*2 + 2116*3

0,374

1,7

 

 

 

1080*4

0,272

1,8

 

 

 

2116*4

0,476

1,9

 

 

 

106 + 3313

0,15

2

 

 

 

RO4450F

0,102

2,1

 

 

 

RO4450F*2

0,204

2,2

 

 

 

RO4450F*3

0,306

2,5

 

 

 

 

 

3

 

 

 

 

 

3,2